The Dionics-USA series of MOS chip capacitors are economical
devices, specifically designed for hybrid circuit applications
where high capacitance values along with reliability, small
physical size, and stability are required. They are extremely
useful where compatible assembly techniques are of prime consideration.
Each device is gold backed and may be conductive epoxy or eutectically bonded with the chip bottom serving as one terminal.
An aluminum bond pad on top of the chip is then contacted,
using conventional wire bonding techniques, to serve as the
Thinnest chips available
Increased high temperature stability
Low leakage current
High capacitance values (0.3 to 330pf)
Multi-value & trimmer capacitors
Custom designs available
General hybrid circuit usage